| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC6VSX315T-2FFG1156I | 单片机MCU |
XILINX/赛灵思 |
BGA1156 |
19+ |
48 |
|||
| SPC5746RK1MMT5 | 单片机MCU |
NXP/恩智浦 |
BGA252 |
21+ |
1782 |
|||
| AT91SAM9X25-CU | IC |
MICROCHIP/微芯 |
BGA217 |
16+ |
96 |
|||
| MKW41Z512VHT4 | IC |
NXP/恩智浦 |
QFN-48 |
23+ |
1264 |
|||
| ADV7392BCPZ-3 | 视频IC |
ADI/亚德诺 |
QFN40 |
24+ |
379 |
|||
| TAS5707PHPR | 运放IC |
TI/德州仪器 |
QFP48 |
18+ |
7000 |
|||
| HI3798MRQCV101000 | HISILICON/海思 |
QFP216 |
1925+ |
120 |
||||
| HI3798MRQCV1010D0 | 其他IC |
HISILICON/海思 |
QFP-216 |
18+ |
200 |
|||
| MW6S004NT1 | 高频器件 |
FREESCALE/飞思卡尔 |
PLD-1.5 |
17+ |
80 |
|||
| MMA8452QR1 | NXP/恩智浦 |
QFN16 |
23+ |
411 |
||||
| XC7K160T-2FFG676I | IC |
XILINX/赛灵思 |
BGA676 |
1413+ |
14 |
|||
| TPS3803-01DCKR | IC |
TI/德州仪器 |
SC70-5 |
24+ |
60000 |
|||
| IT66121FN | IC |
ITE |
QFN-64 |
20+ |
2600 |
|||
| LM53601MQDSXRQ1 | IC |
TI/德州仪器 |
WSON-10 |
22+ |
12000 |
|||
| ADSP-21487KSWZ-3B | IC |
ADI/亚德诺 |
LQFP176 |
14+ |
328 |
|||
| B-3226 | IC |
BTTC |
DIP8 |
24+ |
385 |
|||
| MT47H64M16NF-25E IT:M | MICRON/美光 |
FBGA84 |
20+ |
300 |
||||
| L9369 | 其他IC |
ST/意法 |
QFP64 |
22+ |
3840 |
|||
| TPS61240TDRVRQ1 | IC |
TI/德州仪器 |
WSON-6 |
2249+ |
3000 |
|||
| HD3SS3220RNHR | 电源IC |
TI/德州仪器 |
WQFN-30 |
2138+ |
3100 |
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